The importance of particle size to the performance of abrasive particles in the CMP process

Journal of Electronic Materials

Volumn 25, Issue 10, 1996, Pages 1612-1616

  Pohl, Michael C ^a   Griffiths, Duncan A ^a  

^a HORIBA LTD   (Japan)

Author keywords

Abrasives; Chemical mechanical planarization (CMP); Particle size distribution; Slurries

Indexed keywords

EID: 0001417013     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02655584     Document Type: Article

References (15)

1. Michael A. Martinez, Solid State Tech. September, 44 (1995).
2. Beyer et al., U.S. Patent 4,944,836, July 31, 1990.
3. Geraldine C. Schwartz, presented at SemiCon West on July 14, 1995.
4. Jim Schlueter, presented at SemiCon Southwest 95 on October 18, 1995.
5. Norton Diamond Compounds and Slurries, technical brochure from Norton Company, Abrasives Marketing Group, Worcester, MA 01606-2698.
6. International Energy Agency, Development and Testing of Procedures for Characterization of Ceramic Powders, prepared by NIST for the DOE, September 1993.
7. Cab-O-Sil Fumed Silica Properties and Functions, technical brochure from Cabot Corporation Cab-O-Sil Division, Tuscola, IL 61953.
8. Terence Allen, Particle Size Measurement, Fourth Ed., (New York: Chapman and Hall, 1990).
9. Michael C. Pohl, Powder and Bulk Engineering February 58 (1990).
10. Tatsuo Igushi, presentation from Pittsburgh Conf. 1992 at Atlanta, Georgia.
11. S. Twomey et al., J. Atmospheric Sci. July 1085 (1977).
12. Michael C. Pohl and Jeffrey Dickinson, presented at Fine Powder Characterization course taught at Clemson University, March 1994.
13. Duncan Griffiths, Quality Assurance Manual for Particle Characterization Analyzers, Horiba Instruments Inc., unpublished document.
14. Technical Bulletin Pigment - Basic Characteristics of Aerosil, technical brochure from Degussa AG-Geschaftsbereich Anorganische Chemieprodukte, Frankfurt, Germany.
15. Michael C. Pohl, presented at the Fine Particle Soc. Mtg. Las Vegas, NV, 1990.