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Thin Solid Films

Volumn 304, Issue 1-2, 1997, Pages 1-12

High aspect ratio contacts: A review of the current tungsten plug process

(1) Ireland, P J a

a MICRON TECHNOLOGY INC (United States)

Author keywords

Contacts; Metallization; Titanium; Tungsten

Indexed keywords

ANNEALING; ASPECT RATIO; CHEMICAL VAPOR DEPOSITION; CRYSTAL DEFECTS; GRAIN GROWTH; METALLIZING; SEMICONDUCTOR DOPING; SPUTTER DEPOSITION; TITANIUM NITRIDE;

COLLIMATION; SILICIDATION; TUNGSTEN PLUG PROCESS;

ELECTRIC CONTACTS;

EID: 0031190401 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(96)09557-0 Document Type: Review

Times cited : (57)

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