Modeling of chemical-mechanical polishing with soft pads

Applied Physics A: Materials Science and Processing

Volumn 67, Issue 2, 1998, Pages 249-252

  Shi, F G ^a   Zhao, B ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b Rockwell Semiconductor Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; MATHEMATICAL MODELS; PRESSURE EFFECTS;

CHEMICAL MECHANICAL POLISHING; PLANARIZATION; PRESTON'S EQUATION;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0032139417     PISSN: 09478396     EISSN: None     Source Type: Journal    
DOI: 10.1007/s003390050766     Document Type: Article

References (20)

1. R. DeJule: Semicond. Int. 20, 54 (1997)
2. J.M. Steigerwald, S.P. Murarka, R.J. Gutmann: Chemical Mechanical Planarization of Microelectronic Materials (J. Wiley, New York 1997)
3. F. Preston: J. Soc. Glass. Tech. 11, 214(1927)
4. L.M. Cook: J. Non-Crystal. Solids 120, 152 (1990)
5. L.M. Cook, J.F. Wang, D.B. James, A.R. Sethuraman: Semicond. Int. 18, 141 (1995)
6. For a review of CMP models developed prior to 1995, see G. Nanz, L.E. Camilletti: IEEE Trans. Semicond. Manufact. 8, 382 (1995), and references therein
7. S.R. Runnels: J. Electr. Mater. 25, 1574 (1998), and references therein
8. W.T. Tseng, Y.L. Wang: J. Electrochem. Soc. 144, L15 (1997)
9. C.W. Liu, B.T. Dai, W.T. Tseng, C.F. Yeh: J. Electrochem. Soc. 143, 716 (1996)
10. D. Wang, J. Lee, K. Holland, T. Bibby, S. Beaudoin, T. Cale: J. Electrochem. Soc. 144, 1121 (1997)
11. A.R. Baker: Proc. First Int. Symp. on CMP, p. 228 (1997)
12. T. Yu, C. Yu, M. Orlowski: Int. Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits, p. 29 (1994)
13. E. Tseng, C. Yi, H.C. Chen: Proc. 2nd Int. CMP-MIC, p. 258 (1997)
14. Q. Luo, M.A. Fury, S.V. Babu: Proc. 2nd Int. CMP-MIC, p. 83 (1997)
15. A. Maury, D. Ouma, D. Boning, J. Chung: Presented at Advanced Metallization and Interconnect Systems for ULSI Applications in 1997, San Diego, California, Sept. 30-Oct. 2, 1997
16. H. Takahashi, K. Tokumaga, T. Kasuga, T. Suzuki: Proc. 1997 Symp. VLSI Tech., p. 25 (1997)
17. R. Holm: Electric Contacts (Springer, New York 1967)
18. S. Monmoto et al.: Proc. Electrochem. Soc. 140, 449 (1993)
19. W.T. Tseng, Y.T. Hsieh, C.F. Lin: Solid State Tech. p. 61 Feb. 1997
20. K. Pak, U.I. Chung, Y.B. Koh, M.Y. Lee: Proc. 2nd Int. CMP-MIC, p. 299 (1997)