Monitoring slurry stability to reduce process variability

MICRO

Volumn 15, Issue 8, 1997, Pages 53-63

  Bare, John R ^a,b,c,d   Lemke, Travis A ^a,e  

^a FSI International   (United States)

^b FSI International ^*  (United States)

^c WILLIAMS COLLEGE   (United States)

^d PENNSYLVANIA STATE UNIVERSITY   (United States)

^e UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL PLANARIZATION; ZETA POTENTIAL;

ALGORITHMS; DATA REDUCTION; DENSITY MEASUREMENT (SPECIFIC GRAVITY); MONITORING; PARTICLE SIZE ANALYSIS; PH EFFECTS; PROBES; QUALITY CONTROL; STABILITY; STATISTICAL PROCESS CONTROL;

SLURRIES;

EID: 0031235830     PISSN: 10810595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. Philipossian A, Moinpour M, and Oehler A, "An Overview of Current Issues and Future Trends in CMP Consumables," in Proceedings of the First CMP-MIC Conference, Tampa, FL, VMIC, pp 13-19, February 1996.
2. Bare JP, "Improved Analytical Technique for Metal CMP Slurry," in Proceedings of the Second CMP-MIC Conference, Tampa, FL, VMIC, pp 405-408, February 1997.
3. Scherber D, and Neville M, "Chemical and Mechanical Aspects of Consumables Used in CMP," in Proceedings of Planarization Technology: Chemical Mechanical Polishing (CMP) (Semicon/West), Mountain View, CA, SEMI, 1994.
4. Nagahara R, Lee SK, and You HM, "The Effect of Slurry Particle Size on Defect Levels for a BPSG CMP Process," in Proceedings of 1996 VMIC Conference, Tampa, FL, VMIC, p 443, June 1996.