Tungsten CMP process developed

Solid State Technology

Volumn 41, Issue 4, 1998, Pages 53-56

  Wijekoon, Kapila ^a   Lin, Ronald ^a   Fishkin, Boris ^a   Yang, Susie ^a   Redeker, Fritz ^a   Amico, Gregory ^a   Nanjangud, Savitha ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

TITANIUM; TITANIUM NITRIDE; TUNGSTEN;

TUNGSTEN CHEMICAL MECHANICAL PLANARIZATION (CMP);

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0032035936     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (3)

1. V. Blaschke, et al., 1997 CMP-MIC Conference Proceedings, p. 219.
2. N. Elbel et al., 1997 CMP-MIC Conference Proceedings, p. 75.
3. Y. Shih, 1997 CMP-MIC Conference Proceedings, p. 117.