Integrated electro-chemical mechanical planarization (Ecmp) for future generation device technology

Proceedings of the IEEE 2004 International Interconnect Technology Conference

Volumn , Issue , 2004, Pages 233-235

  Economikos, L ^a   Wang, X ^a   Sakamoto, A ^a   Ong, P ^a   Naujok, M ^a   Knarr, R ^a   Chen, L ^a   Moon, Y ^a   Neo, S ^a   Salfelder, J ^a   Duboust, A ^a   Manens, A ^a   Lu, W ^a   Shrauti, S ^a   Liu, F ^a   Tsai, S ^a   Swart, W ^a  

^a IBM RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROCHEMICAL MECHANICAL PLANARIZATION (ECMP); LOW-K DIELECTRICS; PLANARIZATION; TOPOGRAPHY;

CHEMICAL MECHANICAL POLISHING; CHEMICAL VAPOR DEPOSITION; DEFECTS; DIELECTRIC FILMS; DIELECTRIC PROPERTIES; SILICON WAFERS;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 8644284195     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. M.H. Tsai, et al., IEDM 01, 2001, pp. 80-83.
2. S. Sato, et al., IEDM, 2001.
3. Y. Li and L. Economikos, ECS, 2003.