The challenges of the copper CMP clean

Semiconductor International

Volumn 21, Issue 6, 1998, Pages 117-122

  Hymes, Diane ^a,b   Li, Hugh ^a,b   Zhao, Eugene ^a,c   De Larios, John ^a,b  

^a LAM RESEARCH CORPORATION   (United States)

^b OnTrak Systems   (United States)

^c CMP Division of Lam Research   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; COPPER; COPPER OXIDES; METAL CLEANING; SLURRIES;

CHEMICAL MECHANICAL POLISHING (CMP); COPPER INTERCONNECTS; ZETA POTENTIAL;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0032099573     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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