Effect of slurry viscosity modification on oxide and tungsten CMP

Wear

Volumn 214, Issue 1, 1998, Pages 10-13

  Grover, Gautam S ^a   Liang, Hong ^a   Ganeshkumar, Shari ^a   Fortino, William ^a  

^a CABOT MICROELECTRONICS CORPORATION   (United States)

Author keywords

Chemical mechanical polishing; Slurry wafer; Viscosity

Indexed keywords

COMPOSITION EFFECTS; OXIDES; RHEOLOGY; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; SLURRIES; SUBSTRATES; TUNGSTEN; VISCOSITY OF LIQUIDS;

CHEMICAL MECHANICAL POLISHING (CMP); POLISHING SLURRIES;

CHEMICAL POLISHING;

OXIDE; RHEOLOGY; SLURRY; TUNGSTEN; VISCOSITY;

EID: 0031920304     PISSN: 00431648     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0043-1648(97)00219-6     Document Type: Article

References (11)

1. N. Kirk, J. Wood, Br. Cer. Trans. 93 (1) (1994) 25.
2. L. Cook, J. Non-Cryst. Solids 120 (1990) 152.
3. W. Patrick, W. Guthrie, C. Standley, P. Schiable, J. Electrochem. Soc. 138 (6) (1991) 1778.
4. J. Steigerwald, S. Murarka, R. Gutmann, in: CMP of Microelectronic Materials, Wiley, New York, 1996.
5. J. Coppetta, C. Rogers, A. Philipossian, F. Kaufman, Proc. 2nd CMP-MIC, 307, 1997.
6. W. Rostoker, J.M. McCaughey, H. Markus, in: Embrittlement by Liquid Metals, Van Nostrand-Reinhold, New York, 1960.
7. H. Nichols, W. Rostoker, in: Environment-Sensitive Mechanical Behavior, Gordon & Breach, New York, 1966.
8. H. Tomizawa, T.E. Ficher, ASLE Trans. 90 (1) (1986) 41.
9. T. Izutami, in: M. Tomozawa, R. Doremus (Eds.), Treatise on Materials Science and Technology, Academic Press, New York, 1979.
10. F. Kaufman, D. Thompson, R. Broadie, M. Jaso, W. Guthrie, D. Pearsons, M. Small, J. Electrochem. Soc. 138 (1991) 3460.
11. M. Pourbaix, in: Atlas of Electrochemical Equilibria in Aqueous Solutions, Pergammon, Brussels, 1966.