Chemical-mechanical polishing of copper for interconnect formation

Microelectronic Engineering

Volumn 33, Issue 1-4, 1997, Pages 249-257

  Stavreva, Z ^a   Zeidler, D ^a   Plotner M ^a   Grasshoff, G ^a   Drescher, K ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Chemical mechanical polishing; Copper; Planarization

Indexed keywords

CHEMICAL POLISHING; COPPER; OPTIMIZATION; SILICA;

CHEMICAL MECHANICAL POLISHING (CMP); PLANARIZATION;

MICROELECTRONIC PROCESSING;

EID: 0000467901     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0167-9317(96)00051-2     Document Type: Article

References (12)

1. S. Murarka, T. Seidel and J. Mayer, MRS Bulletin 8 (1993) 15.
2. M. Fury, D. Scherber and M. Stell, MRS Bulletin 11 (1995) 61.
3. B. Roberts, A. Harrus and R. Jackson, Solid State Tech. 2 (1995) 69.
4. F. Kaufman, D. Thompson, R. Broadie, M. Jaso, W. Guthrie, D. Pearson and M. Small, J. Electrochem. Soc. 138 (1991) 3460.
5. R. Gutmann. J. Steigerwald, L. You, D. Price, J. Neirynck, D. Duquette and S. Murarka, Thin Solid Films 270 (1995) 596.
6. H. Landis, P. Burke, W. Cote, W. Hill, C. Hoffman, C. Kaanta, C. Koburger, W. Lange, M. Leach and S. Luce, Thin Solid Films 220 (1992) 1.
7. J. Warnock, J. Electrochem. Soc. 138 (1991) 2398.
8. W. Li, D. Shin, M. Tomozawa and S. Murarka, Thin Solid Films 270 (1995) 621.
9. L. Cook, J. Wang, D. James and A. Sethuraman, Semicond. Intern. 11 (1995) 141.
10. Z. Stavreva, D. Zeidler, M. Plötner and K. Drescher, Appl. Surface Sci. 91 (1995) 192.
11. J. Wang, A. Sethuraman, L. Cook, R. Kistler and G. Schwartz, Semicond. Intern. 10 (1995) 117.
12. D. Zeidler, Z. Stavreva, M. Plötner and K. Drescher, presented at E-MRS Spring Meeting 1996, Strasbourg, Sess. J; to be published.