W-CMP for sub-micron inverse metallization

Microelectronic Engineering

Volumn 33, Issue 1-4, 1997, Pages

  van Kranenburg, Herma ^a   van Corbach, Herman D ^a   Woerlee, Pierre H ^a   Lohmeier, Martin ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; METALLIZING; PRESSURE EFFECTS; TUNGSTEN;

CHEMICAL MECHANICAL POLISHING (CMP); INVERSE METALLIZATION;

MICROELECTRONIC PROCESSING;

EID: 0030730832     PISSN: 01679317     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Review

References (8)