Impact of linewidth and line density on the texture of electroplated Cu in Damascene-fabricated lines

Electrochemical and Solid-State Letters

Volumn 2, Issue 6, 1999, Pages 275-277

  Vanasupa, Linda ^a   Pinck, David ^a   Joo, Young Chang ^b   Nogami, Takeshi ^b   Pramanick, Shekhar ^b   Lopatin, Sergey ^b   Yang, Kai ^b  

^a CALIFORNIA POLYTECHNIC STATE UNIVERSITY   (United States)

^b ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; COPPER; DENSITY (SPECIFIC GRAVITY); ELECTRON DIFFRACTION; ORGANIC COMPOUNDS; SCANNING ELECTRON MICROSCOPY; TEXTURES;

CHEMICAL MECHANICAL POLISHING; DAMASCENE FABRICATED LINES; ELECTRON BACKSCATTER DIFFRACTION;

ELECTROPLATING;

EID: 0032686792     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1390809     Document Type: Article

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