The environment, health and safety side of copper metalization

Semiconductor International

Volumn 21, Issue 6, 1998, Pages 105-110

  Mendicino, Laura ^a,b   Brown, Paul Thomas ^a  

^a MOTOROLA INC   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCIDENT PREVENTION; CHEMICAL POLISHING; CHEMICAL VAPOR DEPOSITION; COPPER; ENVIRONMENTAL IMPACT; HEALTH HAZARDS; METALLIZING;

CHEMICAL MECHANICAL POLISHING (CMP); COPPER METALLIZATION;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0032099121     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. National Technology Roadmap for Semiconductors, 1997 edition, SIA.
2. S. Ventkatesan, et al., IEDM 97, p. 769.
3. L. Mendicino, et al., Advanced Metalization and Interconnect Systems for ULSI Applications in 1997, p. 549.