Copper vs aluminum: A planarization perspective

Semiconductor International

Volumn 19, Issue 6, 1996, Pages 177-184

  Sethuraman, Anantha R ^a   Wang, Jiun Fang ^a   Cook, Lee M ^a  

^a ROHM AND HAAS COMPANY   (United States)

Author keywords

Chemical mechanical planarization; Copper; Interconnects

Indexed keywords

EID: 0343286458     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

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