Chemical Mechanical Polishing of Tungsten: Effect of Tungstate Ion on the Electrochemical Behavior of Tungsten

Electrochemical and Solid-State Letters

Volumn 2, Issue 3, 1999, Pages 143-144

  Osseo Asare, K ^a   Anik, M ^a   DeSimone, J ^a  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DISSOLUTION; ELECTROCHEMISTRY; INTEGRATED CIRCUIT MANUFACTURE; IONS; POLARIZATION; TUNGSTEN;

CHEMICAL MECHANICAL POLISHING (CMP); DIRECT CURRENT POTENTIODYNAMIC POLARIZATION;

CHEMICAL POLISHING;

EID: 0033101767     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1390763     Document Type: Article

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