Substrate effects on hardness and polishing of SiO2 thin films

Journal of the Electrochemical Society

Volumn 145, Issue 5, 1998, Pages 1790-1794

  Kallingal, C G ^a,c   Tomozawa, M ^c   Murarka, S P ^b,c  

^a CYPRESS SEMICONDUCTOR   (United States)

^b ELECTROCHEMICAL SOCIETY

^c RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; DEFORMATION; DEPOSITION; FILM GROWTH; HARDNESS; NONDESTRUCTIVE EXAMINATION; POLISHING; SEMICONDUCTING SILICON; SILICA; SUBSTRATES; THIN FILMS;

CHEMICAL MECHANICAL POLISHING;

SEMICONDUCTING FILMS;

EID: 0032070288     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838559     Document Type: Article

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