Chemical mechanical polishing: Threshold pressure and mechanism

Electrochemical and Solid-State Letters

Volumn 2, Issue 3, 1999, Pages 145-147

  Zhao, Bin ^a   Shi, Frank G ^a  

^a Rockwell Semiconductor Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE; OPTIMIZATION; TRIBOLOGY;

CHEMICAL MECHANICAL POLISHING (CMP); THRESHOLD PRESSURE;

CHEMICAL POLISHING;

EID: 0033101768     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1390764     Document Type: Article

References (12)