Novel ceria-polymer microcomposites for chemical mechanical polishing

Applied Surface Science

Volumn 255, Issue 5 PART 2, 2008, Pages 3090-3096

  Coutinho, Cecil A ^a   Mudhivarthi, Subrahmanya R ^a   Kumar, Ashok ^a   Gupta, Vinay K ^a  

^a UNIVERSITY OF SOUTH FLORIDA   (United States)

Author keywords

CMP; Composite particles; Microgels; Planarization; Polishing; Slurry

Indexed keywords

ABRASIVES; ACRYLIC MONOMERS; CERIUM OXIDE; COMPOSITE MATERIALS; CROSSLINKING; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; INFRARED SPECTROSCOPY; LIGHT SCATTERING; LIGHT TRANSMISSION; MICROSPHERES; NANOPARTICLES; POLISHING; SILICA; SILICON WAFERS; SLURRIES; SURFACE ROUGHNESS; TRANSMISSION ELECTRON MICROSCOPY;

CHEMICAL MECHANICAL POLISHING(CMP); COMPOSITE PARTICLES; MICRO-GELS; N-ISOPROPYLACRYLAMIDES; PARTICLE CHARACTERISTICS; PLANARIZATION; POLYMERIC MICROSPHERE; TOPOGRAPHICAL VARIATIONS;

CHEMICAL MECHANICAL POLISHING;

EID: 57049153421     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2008.08.093     Document Type: Article

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