Effects of slurry particles on silicon dioxide CMP

Journal of the Electrochemical Society

Volumn 151, Issue 8, 2004, Pages

  Choi, Wonseop ^a   Abiade, Jeremiah ^a   Lee, Seung Mahn ^a   Singh, Rajiv K ^a  

^a University of Florida   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT AREA; DYNAMIC CONTACT; FRICTION FORCE; TESTING PERIODS;

ATOMIC FORCE MICROSCOPY; FRICTION; LOADS (FORCES); OPTIMIZATION; PARTICLE SIZE ANALYSIS; PARTICLES (PARTICULATE MATTER); SILICA; SLURRIES;

CHEMICAL MECHANICAL POLISHING;

EID: 4344699165     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1768133     Document Type: Article

References (24)

1. J. M. Steigerwald, S. P. Murarka, and R. J. Gutmann, Chemical-Mechanical Planariaion of Microelectronic Materials, John Wiley & Sons, New York (1997).
2. K. D. Beyer, IBM Micronews, 5, 40 (1999).
3. L. Shon-Roy, Solid State Technol., 43, 67 (2000).
4. R. K. Singh, R. Bajaj, M. Moinpour, and M. Meuris, Mater. Res. Soc. Symp. Proc., 13 (2001).
5. R. Jairath, M. Desai, M. Stell, R. Tolles, and D. Soherber-Brewer. Maier. Res. Soc. Symp. Proc., 337, 121 (1994).
6. Y. Xie and B. Bhushan, Wear, 200, 281 (1996).
7. L. M. Cook, J. Non-Cryst. Solids, 120, 152 (1990).
8. T. Izumitani, in Treatise on Materials Science and Technology, M. Tomozawa and R. Doremus, Editors, p. 115, Academic Press, New York (1979).
9. U. Mahajan, M. Bielmann, and R. K. Singh, Mater. Res. Soc. Symp. Proc., 566, 27 (1999).
10. M. Bielmann, Masters Thesis, University of Florida, Gainesville, FL (1998).
11. U. Mahajan, M. Bielmann, and R. K. Singh, Electrochem, Solid-State Lett., 2, 80 (1999).
12. O. R. Abrahamson, E. J. Dwell, and W. J. Mcdonald, J. Tribal, 113, 249 (1991).
13. N. H. Macmillan, R. D. Huntington, and A. R. C. Westood, J. Mater. Sci., 9, 697 (1974).
14. K. Rajan, R. K. Singh, J. Adler, U. Mahajan, Y. Rabinovioh, and B. M. Moudgil, Thin Solid Films, 529, 308 (1997).
15. S. Ramarajan, Y. Li, M. Hariharaputhiran, Y.-S. Her, and S. V. Babu, Electrochem. Solid-State Lett., 3, 232 (2000).
16. W. Choi, S.-M. Lee, and R. K. Singh, in Chemical-Mechanical Polishing 2001-Advances and Future Challenges, Edited by S. V. Babu, K. C. Cadien, J. G. Ryan, and H. Yano, Mater. Res. Soc. Proc. M5.1, MRS, San Francisco, CA (2001).
17. B. Bhushan, Introduction to Tribology, John Wiley & Sons, New York (2002).
18. D. Myers, Surface, Interfaces, and Colloids: Principles and Applications, 2nd ed. p. 454, John Wiley & Sons, New York (1999).
19. Y. Zhao and L. Chang, Wear, 1, 9026 (2001).
20. S. Timoshenko and J. N. Goodier, Theory of Elasticity, p. 174, McGraw-Hill, New York (1951).
21. W. Choi, S.-M. Lee, J. Abiade, and Rajiv K. Singh, J. Electrochem. Soc., 151, 0367 (2004).
22. B. Zhao and F. Shi, Electrochem. Solid-State Lett., 2, 145 (1999).
23. E. Meyer, Prog. Surf. Sci., 41, 3 (1992).
24. Y. Morii, K. Yamuchi, and K. Endo, Precis. Eng., 9, 123 (1987).