Effects of abrasive morphology and surfactant concentration on polishing rate of ceria slurry

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 42, Issue 3, 2003, Pages 1150-1153

  Katoh, Takeo ^a   Kang, Hyun Goo ^a   Paik, Ungyu ^a   Park, Jea Gun ^a  

^a Hanyang University   (South Korea)

Author keywords

Abrasive; Ceria; CMP; Nitride; Oxide; Selectivity; Slurry; Surfactant; Zeta potential

Indexed keywords

ABRASIVES; ADSORPTION; MORPHOLOGY; SLURRIES; SURFACE ACTIVE AGENTS;

ABRASIVE MORPHOLOGY;

CHEMICAL MECHANICAL POLISHING;

EID: 0038291606     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.42.1150     Document Type: Article

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