Minimization of chemical-mechanical planarization (CMP) defects and post-CMP cleaning

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 5, 1999, Pages 2248-2255

  Zhang, Liming ^a  

^a NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 22844456244     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.590901     Document Type: Article

References (3)

1. L. Zhang, Ph.D. dissertation, University of Arizona, 1998.
2. L. M. Cook, J. Non-Cryst. Solids 120, 152 (1990).
3. J. M. Steigerwald, S. P. Muraka, and R. J. Gutmann, Chemical Mechani-cal Planarization of Microelectronic Materials (Wiley, New York, 1997).