Evaluation of mechanical and tribological behavior, and surface characteristics of CMP pads

Materials Research Society Symposium - Proceedings

Volumn 671, Issue , 2001, Pages

  Sikder, A K ^a   Irfan, I M ^a   Kumar, Ashok ^a   Belyaev, A ^a   Ostapenko, S ^a   Calves, M ^a   Harmon, J P ^a   Anthony, J M ^a  

^a UNIVERSITY OF SOUTH FLORIDA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH RESOLUTION ELECTRON MICROSCOPY; INTERFACES (MATERIALS); MECHANICAL PROPERTIES; MORPHOLOGY; PORE SIZE; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SLURRIES; SURFACE ROUGHNESS; THICKNESS MEASUREMENT; TRIBOLOGY; VISCOELASTICITY;

CHEMICAL MECHANICAL PLANARIZATION; PAD QUALITY; POLISHING PADS; SCANNING ULTRASONIC TRANSMISSION;

CHEMICAL MECHANICAL POLISHING;

EID: 0035742113     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-671-m1.8     Document Type: Conference Paper

References (10)

1. Characterization and metrology of ULSI technology