Chemical mechanical polishing of polymer films

Journal of Electronic Materials

Volumn 27, Issue 10, 1998, Pages 1088-1094

  Towery, Dan ^a   Fury, Michael A ^a  

^a HONEYWELL   (United States)

Author keywords

Chemical mechanical polishing (CMP); FLARE 2.0; Low dielectric

Indexed keywords

CAPACITANCE; DIELECTRIC MATERIALS; ELECTRIC INSULATORS; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; METALS; ORGANIC POLYMERS; PERFORMANCE; PERMITTIVITY; PLASTIC FILMS; SLURRIES; ZIRCONIA;

CAPACITANCE EFFECT; CHEMICAL MECHANICAL POLISHING;

CHEMICAL POLISHING;

EID: 0032182764     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0142-z     Document Type: Article

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