Post cleaning of chemical mechanical polishing process

Applied Surface Science

Volumn 92, Issue , 1996, Pages 176-179

  Liu, Chi Wen ^a   Dai, Bau Tong ^b   Yeh, Ching Fa ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC FILMS; ELECTROSTATICS; HARDNESS; PARTICLES (PARTICULATE MATTER); PH; POLISHING; SEMICONDUCTING SILICON COMPOUNDS; SILICA; SILICON WAFERS; SOLUTIONS; SURFACE CLEANING; SURFACE PROPERTIES;

DIP SOLUTIONS; NANOINDENTATION TECHNIQUE; POST CHEMICAL MECHANICAL POLISHING CLEANING; SILICA PARTICLES; SURFACE HARDNESS; ZETA POTENTIAL;

SURFACE TREATMENT;

EID: 0030562338     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/0169-4332(95)00226-X     Document Type: Article

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