Nanotopography impact of surfactant concentration and molecular weight of nano-ceria slurry on remaining oxide thickness variation after shallow trench isolation chemical mechanical polishing

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 46, Issue 8 A, 2007, Pages 5076-5079

  Park, Jin Hyung ^a   Kanemoto, Manabu ^a   Pair, Ungyu ^a   Park, Jea Gun ^a  

^a Hanyang University   (South Korea)

Author keywords

Ceria slurry; Nanotopography; STI CMP; Surfactant concentration; Surfactant molecular weight

Indexed keywords

CHEMICAL MECHANICAL POLISHING; MOLECULAR WEIGHT; NANOSTRUCTURED MATERIALS; SURFACE ACTIVE AGENTS; THICKNESS CONTROL; TOPOGRAPHY;

CERIA SLURRY; NANOTOPOGRAPHY; SHALLOW TRENCH ISOLATION; SURFACTANT MOLECULAR WEIGHT;

CERIUM COMPOUNDS;

EID: 34547886156     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.46.5076     Document Type: Article

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