Characterization of scratches generated by a multiplaten copper chemical-mechanical polishing process

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 1, 2004, Pages 65-69

  Teo, T Y ^a   Goh, W L ^a   Lim, V S K ^b   Leong, L S ^b   Tse, T Y ^b   Chan, L ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; ALUMINA; CHEMICAL MECHANICAL POLISHING; DIELECTRIC MATERIALS; HARDNESS; METALLIZING; SILICON WAFERS; SLURRIES; SURFACE ROUGHNESS; WATER;

DEFECT SOURCE ANALYSIS (DSA); EMBEDDED PARTICLES; MULTIPLATEN APPROACH;

COPPER;

EID: 1642314302     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1634958     Document Type: Conference Paper

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