Reduction of large particles in ceria slurry by aging and selective sedimentation and its effect on shallow trench isolation chemical mechanical planarization

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 45, Issue 9 A, 2006, Pages 6790-6794

  Kim, Dae Hyeong ^a   Kang, Hyun Goo ^b   Kim, Sang Kyun ^b   Pair, Ungyu ^b   Park, Jea Gun ^a  

^a KCTech   (South Korea)

^b Hanyang University   (South Korea)

Author keywords

Aging; Ceria; Defect; Large particle; Selective sedimentation; STI CMP

Indexed keywords

AGING OF MATERIALS; PARTICLE SIZE ANALYSIS; SEDIMENTATION; SILICON WAFERS; SLURRIES;

CERIA SLURRY; CHEMICAL MECHANICAL PLANARIZATION; OXIDE-NITRIDE; WAFER SURFACE;

CERIUM;

EID: 33749031810     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.45.6790     Document Type: Article

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