Investigation of the nonuniformities in polyurethane chemical mechanical planarization pads

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 24, Issue 1, 2006, Pages 25-33

  Zantye, Parshuram B ^a   Kumar, Ashok ^a   Dallas, William ^a   Ostapenko, Sergei ^b   Sikder, Arun K ^c  

^a University of South Florida   (United States)

^b UNIVERSITY OF SOUTH FLORIDA   (United States)

^c John F Welch GE India Technology Centre Pvt Ltd   (India)

Author keywords

[No Author keywords available]

Indexed keywords

COMMERCIAL PADS; SPATIAL VARIATION; ULTRASOUND TRANSMISSION (UST) ANALYSIS;

CHEMICAL MECHANICAL POLISHING; GRAVITATION; MECHANICAL PERMEABILITY; MECHANICAL PROPERTIES; TRIBOLOGY; ULTRASONIC TRANSMISSION;

POLYURETHANES;

EID: 31544474633     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2137339     Document Type: Article

References (40)

1. P. B. Zantye, A. Kumar, and A. K. Sikder, Mater. Sci. Eng., R. 45, 89 (2004).
2. J. G. Ryan, R. M. Geffken, N. R. Poulin, and J. R. Paraszczak, IBM J. Res. Dev. 39, 371 (1995).
3. S. P. Murarka, Metallization, Theory and Practice for VLSI and ULSI (Butterworth-Heinemann, Boston, 1993).
4. Y. Taur, Y. -J. Mii, D. J. Frank, H. -S. Wong, D. A. Buchanan, S. J. Wind, S. A. Rishton, G. A. Sai-Halasz, and E. J. Nowak, IBM J. Res. Dev. 39, 245 (1995).
5. International Technology Roadmap for Semiconductors (2001).
6. C. L. Borst, W. N. Gill, and R. J. Gutmann, Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology (Kluwer, Boston, 2002).
7. J. Givens, S. Geissler, O. Cain, W. Clark, C. Koburger, and J. Lee, Proceedings of the 11th International VLSI Multilevel Interconnection Conference., 43 (1994).
8. J. M. Steigerwald, S. P. Murarka, M. Gutmann, and R. J. Gutmann, Chemical Mechanical Planarization of Microelectronic Materials (Wiley, New York, 1997).
9. S. H. Li and R. Miller, Chemical Mechanical Polishing in Silicon Processing (Academic, New York, 2000), Vol. 63.
10. F. Preston, J. Soc. Glass Technol. 11, 214 (1927).
11. S. Thagella, A. K. Sikder, and A. Kumar, J. Electrochem. Soc. 151, 205 (2004).
12. P. B. Zantye, A. K. Sikder, S. Thagella, N. Gulati, and A. Kumar, Mater. Res. Soc. Symp. Proc. 750, 39 (2002).
13. Z. Stavreva, D. Zeidler, M. Plötner, and K. Drescher, Microelectron. Eng. 37-38, 143 (1997).
14. D. Castillo-Mejia, J. Kelchner, and S. Beaudoin, J. Electrochem. Soc. 151, G271 (2004).
15. C.-Y. Chen, C.-C. Yu, S.-H. Shen, and M. Ho, J. Electrochem. Soc. 147, 3922 (2000).
16. Y.-R. Jeng, P.-Y. Huang, and W.-C. Pan, J. Electrochem. Soc. 150, G630 (2003).
17. C. Hepburn, Polyurethane Elastomers (Applied Science, London, 1982).
18. K. L. Johnson, Contact Mechanics (Cambridge University Press, Cambridge, 1985).
19. Y. Obeng, Proceedings of the 204th Electrochemical Society Meeting., Orlando, FL, 156 (2003).
20. A. Philipossian and S. Olsen, Mater. Res. Soc. Symp. Proc. 767, F 2.8 (2003).
21. A. S. Lawing, Mater. Res. Soc. Symp. Proc. 732E, I 5.3 (2002).
22. L. J. Borucki, J. Eng. Math. 43, 105 (2002).
23. H. Lu, Y. Obeng, and K. A. Richardson, Mater. Charact. 49, 177 (2002).
24. I. Li, K. M. Forsthoefel, K. A. Richardson, Y. S. Obeng, W. G. Easter, and A. Maury, Mater. Res. Soc. Symp. Proc. 613, E 7.3 (2000).
25. M. Moinpour, A. Tregub, A. Oehler, and K. Cadien, MRS Bull. 27, 766 (2002).
26. H. Lu, B. Fookes, Y. Obeng, and K. A. Richardson, Mater. Charact. 49, 35 (2002).
27. P. B. Zantye, S. Mudhivarthi, A. K. Sikder, A. Kumar, and Y. Obeng, Mater. Res. Soc. Symp. Proc. 816, K 5.6 (2004).
28. P. B. Zantye, A. K. Sikder, A. Kumar, A. Belyaev, I. Tarasov, J. Harmon, and S. Ostapenko, Proceedings of the 204th Electrochemical Society Meeting., Orlando, FL, 183 (2003).
29. D. G. Totzke, M.S. Thesis, University of South Florida, Tampa, FL, May 2000.
30. D. G. Totzke, A. Belyaev, W. Moreno, S. Ostapenko, I. Tarasov, W. Easter, A. Maury, and A. Crevasse, AIP Conf. Proc. 550, 259 (2001).
31. A. K. Sikder, I. M. Irfan, Ashok Kumar, A. Belyaev, S. Ostapenko, M. Calves, J. P. Harmon, and J. M. Anthony, Mater. Res. Soc. Symp. Proc. 670, M 1.8 (2001).
32. M. Moinpour, A. Tregub, A. Oehler, and K. Cadien, MRS Bull. 27, 766, OCT (2002).
33. I. Lacík, I. Krupa, M. Stach, A. Kučma, J. Jurčiová, and I. Chodák, Polym. Test. 19, 755 (2000).
34. L. Woo, M. T. K. Ling, and S. P. Westphal, Thermochim. Acta 272, 171 (1996).
35. F. Podczeck and S. M. Almeida, Eur. J. Pharm. Sci. 16, 209 (2002).
36. A. K. Sikder, Frank Giglio, John Wood, Ashok Kumar, and J. M. Anthony, J. Electron. Mater. 30, 1522 (2001).
37. A. Philipossian and S. Olsen, J. Electrochem. Soc. 151, G 436 (2004).
38. K. Ludema, Friction, Wear, Lubrication: A Text Book in Tribology (CRC, Boca Raton, 1996), p. 90.
39. Maria Ronay and Charles L. Rohn, Tribol. Lett. 14, 205 (2003).
40. Maria Ronay, J. Electrochem. Soc. 151, G 847 (2004).