Role of abrasives in high selectivity STI CMP slurries

Microelectronic Engineering

Volumn 85, Issue 8, 2008, Pages 1748-1753

  Manivannan, R ^a   Ramanathan, S ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY MADRAS   (India)

Author keywords

Ceria; Chemical mechanical planarization; Glutamic acid; Shallow trench isolation; Silica

Indexed keywords

CERIUM COMPOUNDS; CHEMICAL MECHANICAL POLISHING; FOOD ADDITIVES; SEMICONDUCTING SILICON; SILICA; SILICATE MINERALS; SILICON COMPOUNDS; THEOREM PROVING;

ACTIVE SITES; CHEMICAL-MECHANICAL-PLANARIZATION (CMP); CMP SLURRIES; ELSEVIER (CO); GLUTAMIC ACID (GLU); HIGH SELECTIVITY; IDENTICAL CONDITIONS; POLISH RATES; SHALLOW TRENCH ISOLATION (STI); SILICA BASED SLURRIES;

ABRASIVES;

EID: 48949116077     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.04.031     Document Type: Article

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