Localized corrosion effects and modifications of acidic and alkaline slurries on copper chemical mechanical polishing

Applied Surface Science

Volumn 210, Issue 3-4, 2003, Pages 190-205

  Tsai, Tzu Hsuan ^a   Yen, Shi Chern ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Alumina slurry; Chemical mechanical polishing; Copper; Pitting corrosion; Potentiodynamic curve; Surface roughness

Indexed keywords

ALUMINA; ATOMIC FORCE MICROSCOPY; CHEMICAL MECHANICAL POLISHING; COPPER CORROSION; PH EFFECTS; PITTING; SLURRIES; SURFACE ROUGHNESS;

CORROSION EFFECTS;

SURFACE TREATMENT;

EID: 0037446049     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(02)01224-2     Document Type: Article

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