Peeling and delamination in Cu/SiLK™ process during Cu-CMP

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 161-167

  Balakumar, S ^a   Chen, X T ^a   Chen, Y W ^a   Selvaraj, T ^a   Lin, B F ^a   Kumar, R ^a   Hara, T ^b   Fujimoto, M ^b   Shimura, Y ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b HOSEI UNIVERSITY   (Japan)

Author keywords

CMP; Cu SiLK; Delamination and critical pressure; Peeling

Indexed keywords

CHEMICAL MECHANICAL PLANARIZATION (CMP); CMP; CRITICAL PRESSURES; CU/SILK;

ADHESION; CHEMICAL MECHANICAL POLISHING; DELAMINATION; INTEGRATED CIRCUIT MANUFACTURE; METALLIZING; PEELING; PERMITTIVITY; POROUS MATERIALS; PRESSURE EFFECTS;

COPPER;

EID: 4344597872     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.090     Document Type: Article

References (12)

1. Wang S., Grover G., Baker C., Chamberlain J., Yu C. Solid State Technol. 2001 (September);S9.
2. Balakumar S., Hara T. Proceedings of VMIC Conference. 2003;125 IMIC Publishers. ( http:www.imic.org ).
3. S. Balakumar, X.T. Chen, Y.W. Chen (to be submitted).
4. Chen X.T., Tan Y.T., Chen Y.W., Li C.Y., Balakumar S., Chew K., Foo P.D. Proc. 19th VMIC Conference, 2002, Singapore. 2002;156 IMIC Publishers. ( http://www.imic.org ).
5. Hara T. Proceedings of VMIC Asia. 2002 (November);161 IMIC Publishers. ( http://www.imic.org ).
6. Hara T., Toida H. Electrochem. Solid-State Lett. 5:2002;C102.
7. Hara T., Uchida M., Fujimoto M., Doy T.K., Balakumar S., Babu N. Electro-chem. Solid State Lett. 7:2004;G28.
8. Sikder A.K., Zantye P., Thagella S., Kumar A., Vinogradov B.M., Gitis N.V. CMP MIC Proceedings. 2003;120 IMIC Publishers. ( http:www.imic.org ).
9. Endo N., Kondo S., Tokitou S., Yoon B.U., Ohashi N., Sone S., Shin H.J., Matsumoto I., Kobayashi N. CMP-MIC Conference Proceedings. 2003;101 IMIC Publishers. ( http://www.imic.org ).
10. Hara T. Proceedings of 8th CMP-MIC Conference. 2003 (February);773 IMIC Publishers. ( http:www.imic.org ).
11. Kondo S., et al. IITC. 2003;86.
12. S. Balakumar, Y.W. Chen, X.T. Chen, Electochem Solid-State Lett. (to be submitted).