The effect of cerium precursor agglomeration on the synthesis of ceria particles and its influence on shallow trench isolation chemical mechanical polishing performance

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 44, Issue 12, 2005, Pages 8422-8426

  Kim, Dae Hyeong ^a   Kim, Sang Kyun ^b   Kang, Hyun Goo ^b   Park, Jea Gun ^b   Paik, Ungyu ^b  

^a KCTech   (South Korea)

^b Hanyang University   (South Korea)

Author keywords

Agglomeration; Calcination; Ceria; Cerium precursor; STI CMP

Indexed keywords

AGGLOMERATION; CALCINATION; CHEMICAL MECHANICAL POLISHING; CRYSTALLINE MATERIALS; SLURRIES; SYNTHESIS (CHEMICAL);

CERIA; CERIUM PRECURSORS; OXIDE REMOVAL RATES; SHALLOW TRENCH ISOLATION CHEMICAL MECHANICAL POLISHING (STI CMP);

CERIUM;

EID: 31544446320     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.44.8422     Document Type: Article

References (24)

1. H. Nojo, M. Kodera and R. Nakata: Proc. IEEE, San Francisco, CA, 1996, p. 349.
2. K. Hirai, H. Ohtsuki, T. Ashizawa and Y. Kurata: Hitachi Chemical Tech. Rep., 2000, No. 35, p. 17.
3. Y. Tateyama, T. Hirano, T. Ono, N. Miyashita and T. Yoda: Proc. Int. Syrap. Chemical Mechanical Planarization IV, Phoenix, 2000, p. 297.
4. T. Katoh, H. G. Kang, U. Paik and J. G. Park: Jpn. S. Appl. Phys. 42 (2003) 1150.
5. J. P. Kim, U. Paik and J. G. Park: J. Korean Phys. Soc. 39 (2000) 197.
6. T. Detzel, S. Hosali, A. Sethuraman, J. F. Wang and L. Cook: Proc. CMP-MIC Conf., 1997, p. 202.
7. G. B. Basim, J. J. Adler, U. Mahajan, R. K. Singh and B. M. Moudgil: J. Electrochem. Soc. 147 (2000) 3523.
8. R. K. Singh, S. M. Lee, K. S. Choi, G. B. Basim, W. Choi, Z. Chen and B. M. Moudgil: MRS Bull. (Oct., 2002) 752.
9. T. L. Neo, E. S. Y. Shang and C. M. Chong: Proc. Int. Symp. Semiconductor Manufacturing, San Jose, CA, 2001, p. 321.
10. Y. J. Seo, G. U. Kim and W. S. Lee: Microelectron. Eng. 71 (2004) 209.
11. S. H. Lee, Z. Lu, S. V. Babu and E. Matijević: J. Mater. Res. 17 (2002) 2744.
12. T. Hoshino, Y. Kurata, Y. Terasaki and K. Susa: J. Non-Cryst. Solids 283 (2001) 129.
13. S. K. Kim, P. W. Yoon, U. Paik, T. Katoh and J. G. Park: Jpn. J. Appl. Phys. 43 (2004) 7427.
14. O. Levenspiel: Chemical Reaction Engineering (Wiely, New York, 1999) 3rd ed., Chap. 18, p. 378.
15. C. H. Lu and H. C. Wang: Mater. Sci. Eng. B 90 (2002) 138.
16. B. Pacaud, T. K. Doy, Y. Sasakawa and E. Rohart: unpublished.
17. I. Ar and G. Dogu: Chem. Eng. J. 83 (2001) 131.
18. G. Dogu: Chem. Eng. J. 21 (1981) 213.
19. P. Shankar, D. Sundararaman and V. S. Raghunathan: Mater. Lett. 14 (1992) 67.
20. F. Sadi, D. Duprez, F. Gérard and A. Miloudi: J. Catal. 213 (2003) 226.
21. J. G. Park, T. Katoh, W. M. Lee, H. Jeon and U. Paik: Jpn. J. Appl. Phys. 42 (2003) 5420.
22. H. G. Kang, T. Katoh, M. Y. Lee, H. S. Park, U. Paik and J. G. Park: Jpn. J. Appl. Phys. 43 (2004) L1060.
23. S. K. Kim, S. K. Lee, U. Paik and T. Katoh: J. Mater. Res. 18 (2003) 2163.
24. C. F. Yeh, C. W. Hsiao and W. S. Lee: Appl. Surf. Sci. 216 (2003) 46.