The effect of interactions between water and polishing pads on chemical mechanical polishing removal rates

Journal of the Electrochemical Society

Volumn 150, Issue 2, 2003, Pages

  Castillo Mejia, D ^a   Gold, S ^a   Burrows, V ^a   Beaudoin, S ^a  

^a Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; HYDROGEN BONDS; INTEGRATED CIRCUITS; MOLECULAR DYNAMICS; POLYMERS; WATER;

POLISHING PADS;

CHEMICAL MECHANICAL POLISHING;

EID: 0037324119     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1531973     Document Type: Article

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