-
2
-
-
20344366540
-
Impact of SOI thickness fluctuation on threshold voltage variation in ultra-thin body SOI MOSFETs
-
Tsutsui G, Saitoh M, Nagumo T and Hiramoto T 2005 Impact of SOI thickness fluctuation on threshold voltage variation in ultra-thin body SOI MOSFETs IEEE Trans. Nanotechnol. 4 369-73
-
(2005)
IEEE Trans. Nanotechnol.
, vol.4
, Issue.3
, pp. 369-373
-
-
Tsutsui, G.1
Saitoh, M.2
Nagumo, T.3
Hiramoto, T.4
-
3
-
-
0034863489
-
Double-gate fully-depleted SOI transistors for low-power high performance nano-scale circuit design
-
Zhang R, Roy K and Janes D B 2001 Double-gate fully-depleted SOI transistors for low-power high performance nano-scale circuit design ISLPED pp 213-8
-
(2001)
ISLPED
, pp. 213-218
-
-
Zhang, R.1
Roy, K.2
Janes, D.B.3
-
4
-
-
15844418329
-
A new dual-material double-gate (DMDG) nanoscale SOI MOSFET-two dimensional analytical modeling and simulation
-
Reddy G V and Kumar M J 2005 A new dual-material double-gate (DMDG) nanoscale SOI MOSFET-two dimensional analytical modeling and simulation IEEE Trans. Nanotechnol. 4 260-8
-
(2005)
IEEE Trans. Nanotechnol.
, vol.4
, Issue.2
, pp. 260-268
-
-
Reddy, G.V.1
Kumar, M.J.2
-
5
-
-
17444431542
-
Quantum-based simulation analysis of scaling in ultrathin body device structures
-
Kumar A, Kedzierski J and Laux S E 2005 Quantum-based simulation analysis of scaling in ultrathin body device structures IEEE Trans. Electron Devices 52 614-7
-
(2005)
IEEE Trans. Electron Devices
, vol.52
, Issue.4
, pp. 614-617
-
-
Kumar, A.1
Kedzierski, J.2
Laux, S.E.3
-
6
-
-
13344275832
-
Narrow-width SOI devices: The role of quantum-mechanical size quantization effect and unintentional doping on device operation
-
Vasileska D and Ahmed S S 2005 Narrow-width SOI devices: the role of quantum-mechanical size quantization effect and unintentional doping on device operation IEEE Trans. Electron Devices 52 227-36
-
(2005)
IEEE Trans. Electron Devices
, vol.52
, Issue.2
, pp. 227-236
-
-
Vasileska, D.1
Ahmed, S.S.2
-
7
-
-
20344379448
-
Vorticity and quantum interference in ultra-small SOI MOSFETs
-
Gilbert M J and Ferry D K 2005 Vorticity and quantum interference in ultra-small SOI MOSFETs IEEE Trans. Nanotechnol. 4 355-9
-
(2005)
IEEE Trans. Nanotechnol.
, vol.4
, Issue.3
, pp. 355-359
-
-
Gilbert, M.J.1
Ferry, D.K.2
-
8
-
-
0036923438
-
FinFET scaling to 10 nm length
-
Yu B et al 2002 FinFET scaling to 10 nm length IEDM pp 251-4
-
(2002)
IEDM
, pp. 251-254
-
-
Yu, B.1
Al, E.2
-
9
-
-
0036927657
-
FinFET process refinements for improved mobility and gate work function engineering
-
Choi Y-K, Chang L, Ranade P, Lee J-S, Ha D, Balasubramanian S, Agarwal A, Ameen M, King T-J and Bokor J 2002 FinFET process refinements for improved mobility and gate work function engineering IEDM pp 259-62
-
(2002)
IEDM
, pp. 259-262
-
-
Choi, Y.-K.1
Chang, L.2
Ranade, P.3
Lee, J.-S.4
Ha, D.5
Balasubramanian, S.6
Agarwal, A.7
Ameen, M.8
King, T.-J.9
Bokor, J.10
-
10
-
-
32044462305
-
Single crystal nanowire transistor for logic and memory applications
-
Yu B and Meyyappan M 2005 Single crystal nanowire transistor for logic and memory applications NSTI 3 232-5
-
(2005)
NSTI
, vol.3
, pp. 232-235
-
-
Yu, B.1
Meyyappan, M.2
-
11
-
-
0000434281
-
Ti-catalyzed Si nanowires by chemical vapor deposition: Microscopy and growth mechanisms
-
Kamins T I, Williams S R, Basile D P, Hesjedal T and Harris J S 2001 Ti-catalyzed Si nanowires by chemical vapor deposition: microscopy and growth mechanisms J. Appl. Phys. 89 1008-16
-
(2001)
J. Appl. Phys.
, vol.89
, Issue.2
, pp. 1008-1016
-
-
Kamins, T.I.1
Williams, S.R.2
Basile, D.P.3
Hesjedal, T.4
Harris, J.S.5
-
12
-
-
2642566816
-
Ultrahigh-density silicon nanobridges formed between two vertical silicon surfaces
-
Islam M S, Sharma S, Kamins T I and Williams R S 2004 Ultrahigh-density silicon nanobridges formed between two vertical silicon surfaces Nanotechnology 15 L5-8
-
(2004)
Nanotechnology
, vol.15
, Issue.5
-
-
Islam, M.S.1
Sharma, S.2
Kamins, T.I.3
Williams, R.S.4
-
13
-
-
0037912948
-
Growth of silicon nanowires via gold/silane vapor-liquid-solid reaction
-
Westwater J, Gosain D P, Tomiya S, Usui S and Ruda H 1997 Growth of silicon nanowires via gold/silane vapor-liquid-solid reaction J. Vac. Sci. Technol. B 15 554-7
-
(1997)
J. Vac. Sci. Technol.
, vol.15
, Issue.3
, pp. 554-557
-
-
Westwater, J.1
Gosain, D.P.2
Tomiya, S.3
Usui, S.4
Ruda, H.5
-
14
-
-
21644470779
-
A new vertically stacked poly-Si MOSFET for 533 MHz high speed 64 Mbit SRAM
-
Kikuchi T, Moriya S, Nakatsuka Y, Matsuoka H, Nakazato K, Nishida A, Chakihara H, Matsuoka M and Moniwa M 2004 A new vertically stacked poly-Si MOSFET for 533 MHz high speed 64 Mbit SRAM IEDM pp 923-6 (section 13-15)
-
(2004)
IEDM
, pp. 923-926
-
-
Kikuchi, T.1
Moriya, S.2
Nakatsuka, Y.3
Matsuoka, H.4
Nakazato, K.5
Nishida, A.6
Chakihara, H.7
Matsuoka, M.8
Moniwa, M.9
-
15
-
-
28144432921
-
Nano-wires for room temperature operated hybrid CMOS-NANO integrated circuits
-
Ecoffey S, Pott V, Bouvet D, Mazza M, Mahapatra S, Schmid A, Leblebici Y, Declercq M J and Ionescu A M 2005 Nano-wires for room temperature operated hybrid CMOS-NANO integrated circuits IEEE Int. Solid State Circuit Conf. pp 260-2 (section 14.3)
-
(2005)
IEEE Int. Solid State Circuit Conf.
, pp. 260-262
-
-
Ecoffey, S.1
Pott, V.2
Bouvet, D.3
Mazza, M.4
Mahapatra, S.5
Schmid, A.6
Leblebici, Y.7
Declercq, M.J.8
Ionescu, A.M.9
-
16
-
-
0026122410
-
Impact of surrounding gate transistor (SGT) for ultra-high-density LSI
-
Takato H, Sunouchi K, Okabe N, Nitayama A, Hieda K, Horiguchi F and Masuoka F 1991 Impact of surrounding gate transistor (SGT) for ultra-high-density LSI IEEE Trans. Electron Devices 38 573-8
-
(1991)
IEEE Trans. Electron Devices
, vol.38
, Issue.3
, pp. 573-578
-
-
Takato, H.1
Sunouchi, K.2
Okabe, N.3
Nitayama, A.4
Hieda, K.5
Horiguchi, F.6
Masuoka, F.7
-
17
-
-
0038161696
-
High performance silicon nanowire field effect transistors
-
Cui Y, Zhong Z, Wang D, Wang W U and Lieber C M 2003 High performance silicon nanowire field effect transistors Nano Lett. 3 149-52
-
(2003)
Nano Lett.
, vol.3
, Issue.2
, pp. 149-152
-
-
Cui, Y.1
Zhong, Z.2
Wang, D.3
Wang, W.U.4
Lieber, C.M.5
-
18
-
-
21044456044
-
Electronic properties of silicon nanowires
-
Zheng Y, Rivas C, Lake R, Alam K, Boykin T B and Klimeck G 2005 Electronic properties of silicon nanowires IEEE Trans. Electron Devices 52 1097-103
-
(2005)
IEEE Trans. Electron Devices
, vol.52
, Issue.6
, pp. 1097-1103
-
-
Zheng, Y.1
Rivas, C.2
Lake, R.3
Alam, K.4
Boykin, T.B.5
Klimeck, G.6
-
19
-
-
0842331307
-
A computational study of ballistic silicon nanowire transistors
-
Wang J, Polizzi E and Lundstrom M 2003 A computational study of ballistic silicon nanowire transistors IEDM pp 695-8 (section 29.5)
-
(2003)
IEDM
, pp. 695-698
-
-
Wang, J.1
Polizzi, E.2
Lundstrom, M.3
-
20
-
-
0026909715
-
Numerical analysis of a cylindrical thin-pillar transistor (CYNTHIA)
-
Miyano S, Hirose M and Masuoka F 1992 Numerical analysis of a cylindrical thin-pillar transistor (CYNTHIA) IEEE Trans. Electron Devices 39 1876-81
-
(1992)
IEEE Trans. Electron Devices
, vol.39
, Issue.8
, pp. 1876-1881
-
-
Miyano, S.1
Hirose, M.2
Masuoka, F.3
-
21
-
-
9244243065
-
The design of DNA self-assembled computing circuitry
-
Dwyer C, Vicci L, Poulton J, Erie D, Superfine R, Washburn S and Taylor R M 2004 The design of DNA self-assembled computing circuitry IEEE Trans. Very Large Scale Integr. (VLSI) Syst. 12 1214-20
-
(2004)
IEEE Trans. Very Large Scale Integr. (VLSI) Syst.
, vol.12
, Issue.11
, pp. 1214-1220
-
-
Dwyer, C.1
Vicci, L.2
Poulton, J.3
Erie, D.4
Superfine, R.5
Washburn, S.6
Taylor, R.M.7
-
23
-
-
0038009941
-
Investigation of gate induced drain leakage (GIDL) current in thin body devices: Single-gate ultra-thin body, symmetrical double gate, and asymmetrical double gate MOSFETs
-
Choi Y-K, Ha D, King T-J and Bokor J 2003 Investigation of gate induced drain leakage (GIDL) current in thin body devices: single-gate ultra-thin body, symmetrical double gate, and asymmetrical double gate MOSFETs Japan. J. Appl. Phys. 42 2073-6
-
(2003)
Japan. J. Appl. Phys.
, vol.42
, Issue.4 B
, pp. 2073-2076
-
-
Choi, Y.-K.1
Ha, D.2
King, T.-J.3
Bokor, J.4
-
24
-
-
0036474749
-
Impact of gate induced drain leakage on overall leakage of submicrometer CMOS VLSI circuits
-
Semenov O, Pradzynski A and Sachdev M 2002 Impact of gate induced drain leakage on overall leakage of submicrometer CMOS VLSI circuits IEEE Trans. Semicond. Manufac. 15 9-18
-
(2002)
IEEE Trans. Semicond. Manufac.
, vol.15
, Issue.1
, pp. 9-18
-
-
Semenov, O.1
Pradzynski, A.2
Sachdev, M.3
-
25
-
-
0035249575
-
Quantum device-simulation with density gradient model on unstructured grids
-
Wettstein A, Schenk A and Fichtner W 2001 Quantum device-simulation with density gradient model on unstructured grids IEEE Electron Devices 48 279-83
-
(2001)
IEEE Electron Devices
, vol.48
, Issue.2
, pp. 279-283
-
-
Wettstein, A.1
Schenk, A.2
Fichtner, W.3
-
27
-
-
0019003692
-
Relation of drift velocity to low-field mobility and high-field saturation velocity
-
Thornber K 1980 Relation of drift velocity to low-field mobility and high-field saturation velocity J. Appl. Phys. 51 2127-36
-
(1980)
J. Appl. Phys.
, vol.51
, Issue.4
, pp. 2127-2136
-
-
Thornber, K.1
-
28
-
-
0020087475
-
Electron and hole mobilities in silicon as a function of concentration and temperature
-
Arora N D, Hauser J R and Roulston D J 1982 Electron and hole mobilities in silicon as a function of concentration and temperature IEEE Trans. Electron Devices 29 292-5
-
(1982)
IEEE Trans. Electron Devices
, vol.29
, Issue.2
, pp. 292-295
-
-
Arora, N.D.1
Hauser, J.R.2
Roulston, D.J.3
-
29
-
-
0021587240
-
Process and device modeling for VLSI
-
Serberherr S 1984 Process and device modeling for VLSI Microelectron. Reliab. 24 225-57
-
(1984)
Microelectron. Reliab.
, vol.24
, Issue.2
, pp. 225-257
-
-
Serberherr, S.1
-
30
-
-
21044447633
-
On the feasibility of nanoscale triple-gate CMOS transistors
-
Yang J-W and Fossum J 2005 On the feasibility of nanoscale triple-gate CMOS transistors IEEE Trans. Electron Devices 52 1159-64
-
(2005)
IEEE Trans. Electron Devices
, vol.52
, Issue.6
, pp. 1159-1164
-
-
Yang, J.-W.1
Fossum, J.2
-
31
-
-
0036056699
-
Life is CMOS: Why chase the life after?
-
Sery G, Borkar S and De V 2002 Life is CMOS: Why chase the life after? DAC pp 78-83
-
(2002)
DAC
, pp. 78-83
-
-
Sery, G.1
Borkar, S.2
De, V.3
-
32
-
-
21644452674
-
A conventional 45 nm CMOS node low-cost platform for general purpose and low power applications
-
Boeuf F et al 2004 A conventional 45 nm CMOS node low-cost platform for general purpose and low power applications IEDM pp 425-8
-
(2004)
IEDM
, pp. 425-428
-
-
Boeuf, F.1
Al, E.2
-
33
-
-
21644470187
-
Performance enhancement of partially and fully-depleted strained-SOI MOSFETs and characterization of strained-Si device parameters'
-
Numata T et al 2004 Performance enhancement of partially and fully-depleted strained-SOI MOSFETs and characterization of strained-Si device parameters' IEDM pp 177-80
-
(2004)
IEDM
, pp. 177-180
-
-
Numata, T.1
Al, E.2
-
34
-
-
21044438635
-
Ultrashallow junction formation by self-limiting LTP and its application to sub-65 nm node MOSFETs
-
Shima A, Ashihara H, Hiraiwa A, Mine T and Goto Y 2005 Ultrashallow junction formation by self-limiting LTP and its application to sub-65 nm node MOSFETs IEEE Trans. Electron Devices 52 1165-71
-
(2005)
IEEE Trans. Electron Devices
, vol.52
, Issue.6
, pp. 1165-1171
-
-
Shima, A.1
Ashihara, H.2
Hiraiwa, A.3
Mine, T.4
Goto, Y.5
-
35
-
-
21644438774
-
Low power device technology with SiGe channel, HfSiON, and poly-Si gate
-
Wang H C H et al 2004 Low power device technology with SiGe channel, HfSiON, and poly-Si gate IEDM pp 161-4
-
(2004)
IEDM
, pp. 161-164
-
-
Wang, H.C.H.1
Al, E.2
-
36
-
-
21644436688
-
High performance and low power transistors integrated in 65 nm bulk CMOS technology
-
Luo Z et al 2004 High performance and low power transistors integrated in 65 nm bulk CMOS technology IEDM pp 661-4
-
(2004)
IEDM
, pp. 661-664
-
-
Luo, Z.1
Al, E.2
-
38
-
-
0035717948
-
Sub-20 nm CMOS FinFET technologies
-
Choi Y K, Lindert N, Xuan P, Tang S, Ha D and Anderson E 2001 Sub-20 nm CMOS FinFET technologies IEDM pp 421-4
-
(2001)
IEDM
, pp. 421-424
-
-
Choi, Y.K.1
Lindert, N.2
Xuan, P.3
Tang, S.4
Ha, D.5
Anderson, E.6
-
39
-
-
21644446426
-
Transport properties of sub-10 nm planar-bulk-CMOS devices
-
Wakabayashi H et al 2004 Transport properties of sub-10 nm planar-bulk-CMOS devices IEDM pp 429-32
-
(2004)
IEDM
, pp. 429-432
-
-
Wakabayashi, H.1
Al, E.2
-
41
-
-
0035714369
-
High performance symmetric-gate and CMOS compatible Vt asymmetric-gate FinFET devices
-
Kedzierski J, Dried D M, Nowak E J, Kanarsky T and Rankin J H 2001 High performance symmetric-gate and CMOS compatible Vt asymmetric-gate FinFET devices IEDM pp 437-40
-
(2001)
IEDM
, pp. 437-440
-
-
Kedzierski, J.1
Dried, D.M.2
Nowak, E.J.3
Kanarsky, T.4
Rankin, J.H.5
-
43
-
-
33644958333
-
A comparative scaling analysis of metallic and carbon nanotube interconnections for nanometer scale VLSI technologies
-
Srivastava N and Banerjee K 2004 A comparative scaling analysis of metallic and carbon nanotube interconnections for nanometer scale VLSI technologies Proc. 21st Int. Multilevel Interconnect Conf. pp 393-8
-
(2004)
Proc. 21st Int. Multilevel Interconnect Conf.
, pp. 393-398
-
-
Srivastava, N.1
Banerjee, K.2
-
44
-
-
0842331292
-
Process roadmap and challenges for metal barriers
-
Moon P, Dubin V, Johnston S, Leu J, Raol K and Wu C 2003 Process roadmap and challenges for metal barriers IEDM pp 841-4
-
(2003)
IEDM
, pp. 841-844
-
-
Moon, P.1
Dubin, V.2
Johnston, S.3
Leu, J.4
Raol, K.5
Wu, C.6
-
45
-
-
17644448440
-
A 65 nm-node, Cu interconnect technology using porous SiOCH film (k = 2.5) covered with ultra-thin, low-k pore seal (k = 2.7)
-
Tada M et al 2003 A 65 nm-node, Cu interconnect technology using porous SiOCH film (k = 2.5) covered with ultra-thin, low-k pore seal (k = 2.7) IEDM pp 845-8
-
(2003)
IEDM
, pp. 845-848
-
-
Tada, M.1
Al, E.2
-
46
-
-
17644444817
-
2 6T-SRAM cell and robost hybrid-ULK/Cu interconnects for mobile multimedia applications
-
2 6T-SRAM cell and robost hybrid-ULK/Cu interconnects for mobile multimedia applications IEDM pp 285-8
-
(2003)
IEDM
, pp. 285-288
-
-
Nakai, S.1
Al, E.2
-
47
-
-
0842266667
-
Low-pressure CMP for 300-mm ultra low-k (k = 1.6-1.8)/Cu integration
-
Kondo S, Yoon B U, Tokitoh S, Misawa K, Sone S, Shin H J, Ohashi N and Kobayashi N 2003 Low-pressure CMP for 300-mm ultra low-k (k = 1.6-1.8)/Cu integration IEDM pp 151-4
-
(2003)
IEDM
, pp. 151-154
-
-
Kondo, S.1
Yoon, B.U.2
Tokitoh, S.3
Misawa, K.4
Sone, S.5
Shin, H.J.6
Ohashi, N.7
Kobayashi, N.8
-
49
-
-
33846163817
-
Containing the finite size effect in copper lines
-
Alers G B, Sukamto J, Park S, Harm G and Reid J 2006 Containing the finite size effect in copper lines Semicond. Int. 29 38-42
-
(2006)
Semicond. Int.
, vol.29
, Issue.5
, pp. 38-42
-
-
Alers, G.B.1
Sukamto, J.2
Park, S.3
Harm, G.4
Reid, J.5
-
52
-
-
23744492075
-
A review of 0.18νm full adder performances for tree structured arithmetic circuits
-
Chang C H, Gu J and Zhang M 2005 A review of 0.18νm full adder performances for tree structured arithmetic circuits IEEE Trans. Very Large Scale Integr. (VLSI) Syst. 13 686-95
-
(2005)
IEEE Trans. Very Large Scale Integr. (VLSI) Syst.
, vol.13
, Issue.6
, pp. 686-695
-
-
Chang, C.H.1
Gu, J.2
Zhang, M.3
-
55
-
-
0036296689
-
Performance analysis of single-bit full adder cells using 0.18, 0.25 and 0.35νm CMOS technologies
-
Sayed M and Badawy W 2002 Performance analysis of single-bit full adder cells using 0.18, 0.25 and 0.35νm CMOS technologies IEEE Int. Symp. Circuits Syst. pp 559-62
-
(2002)
IEEE Int. Symp. Circuits Syst.
, pp. 559-562
-
-
Sayed, M.1
Badawy, W.2
-
56
-
-
4944244014
-
A study and comparison of full adder cells based on the standard static CMOS logic
-
Khatibzade A A and Raahemifar K 2004 A study and comparison of full adder cells based on the standard static CMOS logic Canadian Conf. Electron. and Comput. Eng. pp 2139-42
-
(2004)
Canadian Conf. Electron. and Comput. Eng.
, pp. 2139-2142
-
-
Khatibzade, A.A.1
Raahemifar, K.2
|