Low-Pressure CMP for 300-mm Ultra Low-k (k=1.6-1.8)/Cu Integration

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 2003, Pages 151-154

  Kondo, S ^a   Yoon, B U ^a   Tokitoh, S ^a   Misawa, K ^a   Sone, S ^a   Shin, H J ^a   Ohashi, N ^a   Kobayashi, N ^a  

^a SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; DIELECTRIC FILMS; ELASTIC MODULI; OPTICAL INTERCONNECTS; ORGANIC POLYMERS; PERMITTIVITY; POROSITY; SILICA; SILICON WAFERS; STRENGTH OF MATERIALS; STRESS ANALYSIS;

DIFFUSION BARRIER (DB); MECHANICAL STRESSES;

PLASTIC FILMS;

EID: 0842266667     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. S. Lin, et al., IITC, p. 146 (2001).
2. S. Sone, et al., VLSI Symposium, p. 125 (2003).
3. S. Kondo, et al., IITC, p. 86 (2003).
4. M. Ikeda, et al., IITC, p. 71 (2003).
5. K. Misawa, et al., Extended Abstracts of SSDM, p. 256 (2003).
6. S. Kondo, et al., Extended Abstracts of SSDM, p.252 (2003).