Process Roadmap and Challenges for Metal Barriers

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 2003, Pages 841-844

  Moon, P ^a   Dubin, V ^a   Johnston, S ^a   Leu, J ^a   Raol, K ^a   Wu, C ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CORROSION; CURRENT DENSITY; ELASTICITY; ELECTRIC CONNECTORS; ELECTRIC RESISTANCE; ELECTRIC WIRE; ELECTRON SCATTERING; INTERFACES (MATERIALS); PHYSICAL VAPOR DEPOSITION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICON NITRIDE;

COPPER INTERCONNECTS; INTERLAYER DIELECTRICS (ILD);

DIELECTRIC FILMS;

EID: 0842331292     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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