Relaxation behavior of polymer structures fabricated by nanoimprint lithography

ACS Nano

Volumn 1, Issue 2, 2007, Pages 84-92

  Ding, Yifu ^a   Wook Ro, Hyun ^a   Germer, Thomas A ^a   Douglas, Jack F ^a   Okerberg, Brian C ^a   Karim, Alamgir ^a   Soles, Christopher L ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

Nanoimprint lithography; Pattern decay; Relaxation; Stability; Thermal embossing

Indexed keywords

ANNEALING TIME; CHAIN RELAXATION; DECAY RATE; DIFFERENT MECHANISMS; FIRST-ORDER DIFFRACTION INTENSITY; IMPRINTING PROCESS; INTENSITY VARIATIONS; LIGHT DIFFRACTION; PATTERN DECAY; POLYMER STRUCTURE; RELAXATION; RELAXATION BEHAVIORS; RIGOROUS COUPLED WAVES; TEMPERATURE DEPENDENCE; THERMAL EMBOSSING; THERMAL-ANNEALING;

ACTIVATION ENERGY; ANNEALING; DECAY (ORGANIC); DIFFRACTION; POLYSTYRENES; VISCOSITY; VISCOUS FLOW;

NANOIMPRINT LITHOGRAPHY;

EID: 38849158096     PISSN: 19360851     EISSN: 1936086X     Source Type: Journal    
DOI: 10.1021/nn700014p     Document Type: Article

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