Real-time shape evolution of nanoimprinted polymer structures during thermal annealing

Nano Letters

Volumn 6, Issue 8, 2006, Pages 1723-1728

  Jones, Ronald L ^a   Hu, Tengjiao ^a   Soles, Christopher L ^a   Lin, Eric K ^a   Reano, Ronald M ^b   Pang, Stella W ^b   Casa, Diego M ^c  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b UNIVERSITY OF MICHIGAN   (United States)

^c ARGONNE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING TIME; NANOIMPRINTED POLYMER; SHAPE EVOLUTION; SIDEWALL ANGLE;

GLASS TRANSITION; MOLDING; OPTICAL RESOLVING POWER; POLYMETHYL METHACRYLATES; THERMAL EXPANSION; X RAY SCATTERING;

NANOSTRUCTURED MATERIALS;

NANOMATERIAL; POLY(METHYL METHACRYLATE);

ARTICLE; CHEMICAL MODEL; CHEMICAL STRUCTURE; CHEMISTRY; COMPUTER SIMULATION; COMPUTER SYSTEM; CONFORMATION; CRYSTALLIZATION; HARDNESS; HEAT; METHODOLOGY; PHASE TRANSITION; SURFACE PROPERTY; ULTRASTRUCTURE; X RAY DIFFRACTION;

COMPUTER SIMULATION; COMPUTER SYSTEMS; CRYSTALLIZATION; HARDNESS; HEAT; MODELS, CHEMICAL; MODELS, MOLECULAR; MOLECULAR CONFORMATION; NANOSTRUCTURES; PHASE TRANSITION; POLYMETHYL METHACRYLATE; SURFACE PROPERTIES; X-RAY DIFFRACTION;

EID: 33748329685     PISSN: 15306984     EISSN: None     Source Type: Journal    
DOI: 10.1021/nl061086i     Document Type: Article

References (16)

1. Heidari, B.; Maximov, I.; Sarwe, E.-L.; Montelius, L. J. Vac. Sci. Technol., B 1999, 17, 2961.
2. Pang, S. W.; Tamamura, T.; Nakao, M.; Ozawa, A.; Masuda, H. J. Vac. Sci. Technol 1998, 16, 1145.
3. Austin, M. D.; Ge, H.; Wu, W.; Li, M.; Yu, Z.; Wasserman, D.; Lyon, S. A.; Chou, S. Y. Appl. Phys. Lett. 2004, 84, 5299.
4. Hua, F.; Sun, Y.; Gaur, A.; Meitl, M. A.; Bilhaut, L.; Rotkina, L.; Wang, J.; Geil, P.; Shim, M.; Rogers, J. A.; Shim, A. Nano Lett. 2004, 4, 2467.
5. 2004 International Technology Roadmap for Semiconductors: http://public.itrs.net.
6. Kerle, T.; Lin, Z.; Kim, H.-C.; Russell, T. P. Macromolecules 2001, 34, 3484.
7. Herminghaus, S.; Seemann, R.; Landfester, K. Phys. Rev. Lett. 2004, 93, 017801.
8. Damman, P.; Baudelet, N.; Reiter, G. Phys. Rev. Lett. 2003, 91, 216101.
9. Jones, R. A. L. Curr. Opin. Colloid Interface Sci. 1999, 4, 153.
10. Jones, R. L.; Hu, T. J.; Lin, E. K.; Wu, W.-L.; Kolb, R. K.; Casa, D. M. ; Boulton, P.; Barclay, G. G. Appl. Phys. Lett. 2003, 83, 4059.
11. Hu, T. J.; Jones, R. L.; Lin, E. K.; Wu, W.-L.; Keane, D.; Weigand, S.; Quintana, J. P. J. Appl. Phys. 2004, 96, 1983.
12. Hamdorf, M.; Johannsmann, D. J. Chem. Phys. 2000, 112, 4262.
13. Petersen, K.; Johannsmann, D. J. Non-Cryst. Solids 2002, 307, 532.
14. Certain commercial equipment and materials are identified in this paper in order to specify the experimental procedure adequately. In no case does such specification imply recommendation by the National Institutes of Standards and Technology nor does it imply that the material or equipment specified is necessarily the best available for this purpose.
15. The data in this manuscript and in the figures are presented along with the standard uncertainty (±) involved in the measurement, where the uncertainty represents one standard deviation from the mean.
16. Hartschuh, R.; Ding, Y.; Roh, J. H.; Kisliuk, A.; Sokolov, A. P.; Soles, C. L.; Wu, W.-L.; and Mahorowala, A. P. J. Polym. Sci., Part B: Polym. Phys. 2004, 42, 1106.