Defect analysis in thermal nanoimprint lithography

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 21, Issue 6, 2003, Pages 2765-2770

  Hirai, Yoshihiko ^a   Yoshida, Satoshi ^a   Takagi, Nobuyuki ^a  

^a Osaka Prefecture University   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COMPUTER SIMULATION; COOLING; DEFECTS; DEFORMATION; FINITE ELEMENT METHOD; FRACTURE; GLASS TRANSITION; HOT PRESSING; STRAIN; STRESS ANALYSIS; STRESS CONCENTRATION; THERMAL EFFECTS; THERMAL EXPANSION; THERMAL STRESS; THERMOPLASTICS;

NANOIMPRINT LITHOGRAPHY; STRAIN DISTRIBUTION;

LITHOGRAPHY;

EID: 0942300052     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1629289     Document Type: Conference Paper

References (10)

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