Mechanical properties of sintered Ag-Cu die-attach nanopaste for application on SiC device

Materials and Design

Volumn 64, Issue , 2014, Pages 166-176

  Tan, Kim Seah ^a   Cheong, Kuan Yew ^a  

^a SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

Author keywords

Bonding strength; Hardness; Lap shear; Metallization; Nanoindentation; Young's modulus

Indexed keywords

BINARY ALLOYS; COATINGS; ELASTIC MODULI; HARDNESS; METALLIZING; METALS; MICROSTRUCTURE; NANOINDENTATION; NANOPARTICLES; SILICON CARBIDE; SUBSTRATES; TESTING; THERMAL AGING;

AG AND CU NANOPARTICLES; BONDING STRENGTH; BONDING STRUCTURE; CU NANO-PARTICLES; INTERFACE MI-CROSTRUCTURE; LAP SHEAR; METALLIZATION LAYERS; THERMAL AGING TESTS;

COPPER COMPOUNDS;

EID: 84908131431     PISSN: 02641275     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2014.07.033     Document Type: Article

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