SCOPUS 정보 검색 플랫폼

Journal of Alloys and Compounds

Volumn 509, Issue 26, 2011, Pages 7238-7246

Structural and elastic properties of eutectic Sn-Cu lead-free solder alloy containing small amount of Ag and in

(6) El Daly, A A a El Tantawy, Farid b Hammad, A E a Gaafar, M S c,e El Mossalamy, E H d Al Ghamdi, A A d

a Zagazig University (Egypt)

b Suez Canal University (Egypt)

c NATIONAL INSTITUTE FOR STANDARDS (Egypt)

d KING ABDULAZIZ UNIVERSITY (Saudi Arabia)

e MAJMAAH UNIVERSITY (Saudi Arabia)

Author keywords

Elastic properties; Lead free solder; Mechanical properties; Microstructure; Pulse echo technique; Sn Cu alloys

Indexed keywords

BULK MODULUS; ELASTIC BEHAVIOR; ELASTIC PROPERTIES; ENHANCED DUCTILITY; GRAIN DIMENSION; HIGH TEMPERATURE; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; LEAD-FREE; LEAD-FREE SOLDER ALLOY; MATRIX; MICROSTRUCTURAL ANALYSIS; OBSCURE EFFECTS; POISSON'S RATIO; PULSE-ECHO TECHNIQUE; QUATERNARY ALLOYS; SHEAR MODULUS; SHEAR WAVE VELOCITY; SN DENDRITES; SN-CU ALLOYS; SN-CU SOLDERS; WEAK INTERFACE;

ALLOYING; CERIUM ALLOYS; COPPER ALLOYS; ELASTIC MODULI; ELASTICITY; EUTECTICS; FRACTURE MECHANICS; INTERMETALLICS; MICROELECTRONICS; MICROSTRUCTURE; POISSON RATIO; SHEAR FLOW; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS; ULTRASONIC APPLICATIONS;

TIN;

EID: 79957490137 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2011.01.062 Document Type: Article

Times cited : (52)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.