Influence of joining conditions on bonding strength of joints: Efficacy of low-temperature bonding using Cu nanoparticle paste

Journal of Electronic Materials

Volumn 42, Issue 6, 2013, Pages 1260-1267

  Yamakawa, Tomohiro ^a   Takemoto, Tadashi ^a   Shimoda, Masayoshi ^a,b   Nishikawa, Hiroshi ^a   Shiokawa, Kunio ^b   Terada, Nobuto ^c  

^a OSAKA UNIVERSITY   (Japan)

^b FUJI ELECTRIC CO   (Japan)

^c Harima Chemicals Inc   (Japan)

Author keywords

Bonding; electronic device; joint process; lead free solder; nanoparticle; sintering

Indexed keywords

BONDING TEMPERATURES; ELECTRONIC DEVICE; JOINT PROCESS; LEAD FREE SOLDERS; LOW TEMPERATURE BONDING; LOW-TEMPERATURE BONDING PROCESS; NANOPARTICLE SURFACE; PREHEATING PROCESS;

BOND STRENGTH (CHEMICAL); DIFFUSION BONDING; DUCTILE FRACTURE; NANOPARTICLES; SINTERING; TEMPERATURE;

BONDING;

EID: 84877755228     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-013-2583-2     Document Type: Article

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