Processing and reliability issues for eutectic AuSn solder joints

Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008

Volumn , Issue , 2008, Pages 909-916

  McNulty, John C ^a  

^a DfR Solutions LLC   (United States)

Author keywords

AuSn; Diffusion; Eutectic; Metallization; Reflow; Reliability

Indexed keywords

AUSN; FIELD RELIABILITY; HERMETIC PACKAGING; HETEROGENEOUS PHASE; MATERIAL AND PROCESS SELECTIONS; REFLOW; REFLOW TEMPERATURES; TELECOMMUNICATIONS APPLICATIONS;

DIFFUSION; EUTECTICS; HIGH TEMPERATURE APPLICATIONS; LEAD; LIGHT EMITTING DIODES; METALLIZING; MICROELECTRONICS; MILITARY APPLICATIONS; MOEMS; PACKAGING; RELIABILITY; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 79952323423     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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