Interfacial reactions of high-Bi alloys on various substrates

Journal of Electronic Materials

Volumn 43, Issue 1, 2014, Pages 155-165

  Wang, Jin Yi ^a   Chen, Chih Ming ^a   Yen, Yee Wen ^b  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Bi; high temperature solder; Interfacial reaction; substrate

Indexed keywords

HIGH TEMPERATURE; JOINT INTERFACES; MORPHOLOGICAL EVOLUTION; PB FREE SOLDERS; SI CHIPS; SN CONCENTRATION; SOLDER JOINTS; VARIOUS SUBSTRATES;

BISMUTH; BISMUTH COMPOUNDS; INTERFACES (MATERIALS); INTERMETALLICS; LEAD; POWER ELECTRONICS; SOLDERING ALLOYS; SURFACE CHEMISTRY; TIN; TIN ALLOYS;

SUBSTRATES;

EID: 84891831898     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-013-2703-z     Document Type: Article

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