Mechanical characterization of an Au-Ge solder alloy for high temperature electronic devices

2010 6th International Conference on Integrated Power Electronics Systems, CIPS 2010

Volumn , Issue , 2011, Pages

  Msolli, Sabeur ^a   Dalverny, Olivier ^a   Alexis, Joel ^a   Karama, Moussa ^a  

^a UNIVERSITÉ DE TOULOUSE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP AND FATIGUE; DEGRADATION OF THE MATERIAL; DISPLACEMENT RATE; ELASTO-VISCOPLASTIC; EXPERIMENTAL DATA; HIGH TEMPERATURE ELECTRONIC DEVICES; LOADING CONDITION; MECHANICAL BEHAVIOUR; MECHANICAL CHARACTERIZATIONS; MECHANICAL RESPONSE; SOLDER ALLOYS; UNIFIED VISCOPLASTIC MODELS;

GERMANIUM; LOADING;

POWER ELECTRONICS;

EID: 79953736070     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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