Tensile behaviors and ratcheting effects of partially sintered chip-attachment films of a nanoscale silver paste

Journal of Electronic Materials

Volumn 37, Issue 10, 2008, Pages 1574-1579

  Chen, Xu ^a   Li, Rong ^a   Qi, Kun ^a   Lu, Guo Quan ^b  

^a TIANJIN UNIVERSITY   (China)

^b VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

Chip attachment; Cyclic tension; Dynamic mechanical analyzer; Elastic modulus; Low temperature sintering; Nanoscale silver paste; Ratcheting; Stress strain curve

Indexed keywords

CERAMIC SUBSTRATES; CHIP ATTACHMENT; CYCLIC TENSION; DYNAMIC MECHANICAL ANALYZER; ELASTIC MODULUS; LOADING RATES; LOW-TEMPERATURE SINTERING; MEAN STRESSES; MECHANICAL BEHAVIORS; NANOSCALE SILVER PASTE; RATCHETING; RATCHETING STRAIN; SEMICONDUCTOR CHIPS; SILVER FILMS; SINTERED FILMS; STRESS AMPLITUDES; STRESS-STRAIN CURVE; TENSILE BEHAVIORS;

CABLE STAYED BRIDGES; ELECTRONICS INDUSTRY; MOLECULAR BEAM EPITAXY; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; ORGANIC POLYMERS; SINTERING; STRESS-STRAIN CURVES; STRESSES; SUBSTRATES; THICK FILMS;

SILVER;

EID: 51849143608     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0516-2     Document Type: Article

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