Bonding silicon chips to aluminum substrates using ag-in system without flux

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 3, Issue 5, 2013, Pages 711-715

  Wu, Yuan Yun ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Aluminum substrate; indium; silicon chip; silver; silver indium alloys

Indexed keywords

ALUMINUM SUBSTRATE; BONDING STRUCTURE; ENERGY DISPERSIVE X-RAY; FLUXLESS BONDING; SILICON CHIP; SILVER-INDIUM ALLOY; SOLID SOLUTION PHASE; SUBSTRATE MATERIAL;

ALUMINUM; INDIUM; INDIUM ALLOYS; SILICON; SILVER;

SUBSTRATES;

EID: 84877298654     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2013.2240767     Document Type: Article

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