Joining of Cu, Ni, and Ti using Au-Ge-based high-temperature solder alloys

Journal of Materials Engineering and Performance

Volumn 23, Issue 5, 2014, Pages 1585-1592

  Weyrich, Nico ^a   Jin, Shan ^a,b   Duarte, Liliana I ^a,c   Leinenbach, Christian ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b Thermo Calc Software AB   (Sweden)

^c ABB SWITZERLAND LTD   (Switzerland)

Author keywords

high temperature solder; joining; lead free solder; soldering

Indexed keywords

ALLOYS; CORROSION RESISTANCE; ELECTRIC PROPERTIES; EUTECTICS; GERMANIUM; JOINING; MECHANICAL PROPERTIES; MELTING POINT; NICKEL; SOLDERING;

HIGH TEMPERATURE; INTERFACE REACTIONS; LEAD CONTAINING SOLDERS; LEAD FREE SOLDERS; LOW MELTING TEMPERATURES; SOLDER ALLOYS; STRENGTH VALUES; THERMAL AND ELECTRICAL CONDUCTIVITY;

SOLDERING ALLOYS;

EID: 84901054619     PISSN: 10599495     EISSN: 15441024     Source Type: Journal    
DOI: 10.1007/s11665-014-0864-4     Document Type: Conference Paper

References (19)

1. V. Chidambaram, J. Hattel, and J. Hald, High Temperature Lead-Free Solder Alternatives, Microelectron. Eng., 2011, 88(6), p 981-989
2. V. Chidambaram, J. Hald, and J. Hattel, Development of Au-Ge Based Candidate Alloys as an Alternative to High-Lead Content Solders, J. Alloys Compd., 2010, 490(1-2), p 170-179
3. F.Q. Lang, H. Yamaguchi, H. Ohashi, and H. Sato, Improvement in Joint Reliability of SiC Power Devices by a Diffusion Barrier Between Au-Ge Solder and Cu/Ni(P) Metalized Ceramic Substrates, J. Electron. Mater., 2011, 40(7), p 1563-1571
4. V. Chidambaram, H.B. Yeung, and G. Shan, Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics, J. Electron. Mater., 2012, 41(8), p 2107-2117
5. S. Msolli, O. Dalverny, J. Alexis, and M. Karama, Mechanical Characterization of an Au-Ge Solder Alloy for High Temperature Electronic Devices, Presented at: CIPS (2010), Nuremberg, Poster P4.
6. C. Leinenbach, F. Valenza, D. Giuranno, H.R. Elsener, S. Jin, and R. Novakovic, Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates, J. Electron. Mater., 2011, 40(7), p 1533-1541
7. 3-Ceramics Using Eutectic Au-(Ge, Si) Alloys, J. Mater. Sci., 2013, 48, p 7115-7124
8. N. Weyrich, L.I. Duarte, C. Leinenbach, and D. Lado, Joining of Titanium and Nickel at Temperatures Below 450°C, Brazing, High Temperature Brazing and Diffusion Bonding - Löt 2013, Aachen, Germany, June 18-20, 2013, p 22-27.
9. J. Wang, C. Leinenbach, and M. Roth, Thermodynamic Description of the Au-Ge-Sb Ternary System, J. Alloys Compd., 2009, 485(1), p 577-582
10. J. Wang, C. Leinenbach, and M. Roth, Thermodynamic Modeling of the Au-Ge-Sn Ternary System, J. Alloys Compd., 2009, 481(1-2), p 830-836
11. V. Chidambaram, J. Hard, R. Ambat, and J. Hattel, A Corrosion Investigation of Solder Candidates for High-Temperature Applications, JOM, 2009, 61(6), p 59-65
12. S. Jin, F. Valenza, R. Novakovic, and C. Leinenbach, Wetting Behavior of Ternary Au-Ge-X (X = Sb, Sn) Alloys on Cu and Ni, J. Electron. Mater., 2013, 42(6), p 1024-1032
13. T.B. Massalski, H. Okamoto, P.R. Subramanlan, and L. Kacprzak, Binary Alloy Phase Diagrams. ASM, Materials Park, 1990. Reprinted with the permission of ASM International. All rights reserved. www.asminternational.org. Accessed 21 Oct 2013
14. 3 with Electron Diffraction, Z. Angew. Phys., 1952, 4, p 7
15. 3Au by Means of Electron Diffraction and Electron Microscopy, J. Phys. Soc. Jpn., 1962, 17, p 1030-1041
16. 3Au as Studies by Transmission Electron Microscopy, Metall. Trans., 1971, 2(6), p 1635-1641
17. Y. Zhang, C. Li, Z. Du, and C. Guo, A Thermodynamic Assessment of Ni-Sb System, CALPHAD, 2008, 32(2), p 378-388
18. S. Jin, C. Leinenbach, J. Wang, L.I. Duarte, S. Delsante, G. Borzone, A. Scott, and A. Watson, Thermodynamic Study and Re-assessment of the Ge-Ni System, CALPHAD, 2012, 38, p 23-34
19. A. Paul, Growth Mechanism of Phases, Kirkendall Voids, Marker Plane Positions and Indication of the Relative Mobilities of the Species in the Interdiffusion Zone, J. Mater. Sci. Mater. Electron., 2011, 22, p 833-837