Characterization of aging effects in lead free solder joints using nanoindentation

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2013, Pages 166-178

  Hasnine, Mohammad ^a   Mustafa, Muhannad ^a   Suhling, Jeffrey C ^a   Prorok, Barton C ^a   Bozack, Michael J ^a   Lall, Pradeep ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON BACK SCATTERED DIFFRACTION TECHNIQUES; ELECTRONIC ASSEMBLIES; LEAD-FREE SOLDER ALLOY; LEAD-FREE SOLDER JOINT; MECHANICAL RESPONSE; NANOINDENTATION CREEPS; NANOINDENTATION TECHNIQUES; SOLIDIFICATION RATE;

CHARACTERIZATION; CREEP; CREEP TESTING; CRYSTAL ORIENTATION; HARDNESS; MICROSTRUCTURE; NANOINDENTATION; SOLDERED JOINTS; SOLIDIFICATION; TENSILE TESTING; THERMAL AGING; YIELD STRESS;

SOLDERING;

EID: 84883349044     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2013.6575568     Document Type: Conference Paper

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