Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame

Journal of Materials Science: Materials in Electronics

Volumn 23, Issue 1, 2012, Pages 115-123

  Haque, A ^a   Lim, B H ^b   Haseeb, A S M A ^a   Masjuki, H H ^a  

^a UNIVERSITY OF MALAYA   (Malaysia)

^b ON Semiconductor SCG Industries M Sdn Bhd Malaysia   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

ACCEPTABLE LIMIT; BULK SOLDER; DIE ATTACHMENT; ELECTRICAL TESTS; ENTIRE DIE; FORMING GAS; HIGH TEMPERATURE; IMC LAYER; LEAD FREE SOLDERS; LEAD-FRAME; MELTING RANGE; OUTPUT VOLTAGES; SOLDER WIRES; THERMAL CYCLE;

ALUMINUM; COPPER COMPOUNDS; DIES; GALLIUM; GALLIUM ALLOYS; LEAD; LEAD COMPOUNDS; SILICON; SILVER ALLOYS; SOLDERING ALLOYS; TIN; ZINC; ZINC ALLOYS;

COPPER;

EID: 84856977101     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-011-0511-x     Document Type: Article

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