SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 1, 2009, Pages 164-174

Ceramic substrates for high-temperature electronic integration

(4) Chasserio, N a Guillemet Fritsch, S a Lebey, T b Dagdag, S c

a INSTITUT CARNOT CIRIMAT (France)

b d'Hydraulique et des Telecommunications (France)

c ALSTOM (France)

Author keywords

Ceramic substrate; High temperature electronics; Packaging; Passive component; System integration

Indexed keywords

CERAMIC SUBSTRATE; ELECTRONIC DEVICES; ELECTRONIC INTEGRATIONS; HIGH POWERS; HIGH-TEMPERATURE ELECTRONICS; OPERATING TEMPERATURES; PASSIVE COMPONENT; POWER HANDLING CAPACITIES; POWER MODULES; SEMI-CONDUCTORS; SYSTEM INTEGRATION;

CERAMIC MATERIALS; CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; GALLIUM ALLOYS; INTEGRATION; SEMICONDUCTOR MATERIALS;

SUBSTRATES;

EID: 57649176877 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0571-8 Document Type: Conference Paper

Times cited : (54)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.